導熱矽膠片 HP Series

產品介紹/Introduction

HP系列導熱矽膠片適用於填充加熱元件和散熱片或金屬基底之間空隙。其材質柔軟性和彈性使它們適合於非常不平的表面的塗層。熱可以傳輸至從分開的元件或甚至整個PCB，這在效果增強了發熱的電子元件的效率和壽命時間的金屬外殼或散熱板。

HP Series thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base. Their flexibility and elasticity make them suited to the coating of the very uneven surfaces. Heat can transmit to the metal housing or dissipation plate from the separate elements or even the entire PCB, which in effect enhances the efficiency and life-time of the heat-generating electronic components.

產品應用/Applications

散熱矽膠片多半使用於功率轉換設備、散熱模組、 LED照明設備、汽車發動機控制單元、電子零件之IC、CPU、MOSLED、Heat Sink...等。

● Computer services: CPU, Heat sink, Memory modules

● LED Lighting, LCD-TV

● Military Electronics

● Power Supplies

● Telecom services, Wireless instruments

● Automotive control services

產品規格/Specifications

產品特點/Advantages

Other Description

The data listed above are typical test results obtained from a series of laboratory tests.

Many factors may affect the application performance of this product, please conduct the performance experiment to make sure the approach is available refer to the suggestions of the professional before putting into particular purpose.

We can supply your ordering quantity as standard products for stock sale , and special type (In case of smaller than standard size) are needed a few days after your order.